Every product line runs on our own floor in Songgang, Shenzhen. Each page lists the limits we build to, the materials we use and the questions engineers ask before ordering.
HDI is where we started and where most of our engineering effort goes. We build blind and buried microvia boards from one to seven sequential lamination steps, and any-layer structures where every layer is connected by copper-filled laser vias.
From four-layer controllers to thick backplanes, multilayer boards make up most of our volume. We laminate up to 64 layers, drill through-holes at a 25:1 aspect ratio and plate them evenly on pulse plating lines.
Direct-view LED panels need boards with enormous hole counts, very flat surfaces and a uniform black mask. Our P1.25 module board is a good example: four layers, 0.6 mm thick, 159,300 drilled holes and 177,300 electrical test points on one board.
Rigid-flex boards replace connectors and cables with flexible polyimide layers laminated into the rigid sections. That saves space, removes failure points and makes assembly simpler.
For RF and high-speed digital boards the laminate is part of the circuit. We build on Rogers, PTFE and low-loss FR-4-class materials such as TU872 and IT-180, either alone or in hybrid stacks that put expensive material only where the signals need it.
Metal-core boards move heat away from LEDs and power devices through a thin dielectric bonded to an aluminium or copper base.
Heavy copper boards carry high current and spread heat without bus bars. We plate up to 8 oz finished copper and combine heavy copper power layers with standard signal layers in one multilayer board.
Upload Gerber or ODB++, stack-up and quantities. Standard PCB quotes usually take 30 minutes in working hours; HDI, rigid-flex and special materials usually take up to 24 hours.